STS Dual Chamber ICP DRIE ASPECT Cluster Etcher
(Bosch Process)
(Bosch Process)
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STS dual chamber ICP cluster etcher (200mm) configured for Bosch
process. Both chambers are identical in configuration with gases and
corresponding MFC sizes, as shown below:
process. Both chambers are identical in configuration with gases and
corresponding MFC sizes, as shown below:
- C4F8 400 sccm
- SF6 600 sccm
- O2 100 sccm
- Ar 50 sccm
- CF4 50 sccm
- CHF3 100 sccm
- HBr 200 sccm
- BCl3 100 sccm
- Cl2 200 sccm
- He 100 sccm
- N2 100 sccm
- N2 200 sccm
