Semiconductor Equipment Corporation (SEC)
3150 Wafer/Film Frame Tape Applicator
3150 Wafer/Film Frame Tape Applicator
Semiconductor Equipment Corporation (SEC) Model 3150 Wafer/Film Frame
Tape Applicator is capable of handling wafers up to 8" in diameter. System
applies tape with optimal control of temperature and pressure parameters
resulting in uniform, bubble-free mounting of tape for wafer dicing.
State-of-the-art features make this model one of the most advanced and
versatile systems available.
Tape Applicator is capable of handling wafers up to 8" in diameter. System
applies tape with optimal control of temperature and pressure parameters
resulting in uniform, bubble-free mounting of tape for wafer dicing.
State-of-the-art features make this model one of the most advanced and
versatile systems available.
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Click Here to Download SEC 3150 Wafer Film Frame Tape Applicator Specs