system which offers unsurpassed, highly economical mass
production capabilities for cassette to cassette handling of
wafers up to 4" wafers and 5" masks, although smaller
wafers and chips may be mounted to a 4" carrier wafer and
processed. The light sources are a 30 W Deuterium lamp
with 310 nm wavelength and a 350 W mercury arc lamp with
365 nm wavelength. The vacuum contact mode is available.
The microscope has dual alignment objectives and
split-field viewing. The mask and microscope have
motorized motion in x and y, and they may be moved
together or independently over the stationary wafer.
