double side exposure and manual operation of wafers with
a maximum wafer diameter of 5" and maximum mask size
of 6" x 6".
Tool is equipped with diffraction reducing optical systems
and 350W HBO lamps.
Tool features choice of bright field and dark field
illimination, an alignment accuracy between upper and
lowe side of the wafer of <2 microns, and alignment table
rotation of <2 degrees.
