Fabrication Services
We provide semiconductor processing services with capabilities of handling wafer sizes up to 8”.
  • Thin and thick resists (positive and negative)
  • Contact and proximity alignment/exposure
  • Back Side Alignment
  • 5X reduction stepper
  • Wet etching of oxides and metals
  • Anisotropic wet etching of silicon
  • Reactive ion etching of oxides, nitrides, and polymers
  • Deep Reactive Ion Etching.  
  Thin Film Deposition
  • DC/RF sputtering of metals and dielectrics
  • Electron beam evaporation of metals
  • Low Pressure Chemical Vapor Deposition (LPCVD)
  • Low Temperature and High temperature Oxide
  • Regular and Low Stress Silicon Nitride
  • Amorphous and Polycrystalline Silicon
  • Plasma Enhanced Chemical Vapor Deposition
  Thermal Processing
  • Furnace Oxidation and Diffusion
  • High-temperature furnace anneals.
  Wafer Bonding
  • Fusion bonding
  • Thermocompression bonding
  • Anodic bonding
Photonic Microdevices Inc.