We provide semiconductor processing services with capabilities of handling wafer sizes up to 8”.
- Thin and thick resists (positive and negative)
- Contact and proximity alignment/exposure
- Back Side Alignment
- 5X reduction stepper
- Wet etching of oxides and metals
- Anisotropic wet etching of silicon
- Reactive ion etching of oxides, nitrides, and polymers
- Deep Reactive Ion Etching.
Thin Film Deposition
- DC/RF sputtering of metals and dielectrics
- Electron beam evaporation of metals
- Low Pressure Chemical Vapor Deposition (LPCVD)
- Low Temperature and High temperature Oxide
- Regular and Low Stress Silicon Nitride
- Amorphous and Polycrystalline Silicon
- Plasma Enhanced Chemical Vapor Deposition
- Furnace Oxidation and Diffusion
- High-temperature furnace anneals.
- Fusion bonding
- Thermocompression bonding
- Anodic bonding
Photonic Microdevices Inc.